| abstract |
A metal base material excellent in solder adhesion and weather resistance while using a metal base material containing an element having high reactivity with oxygen at room temperature. (Solution) An electroplating method for depositing a plated metal layer on a surface of a part or all of a metal substrate, the plating layer being selected from the group consisting of a Co plating layer and an alloy plating layer containing two or more elements selected from the group consisting of Co, Ni and Mo A coated metal base having a total coating amount of Co, Ni and Mo of 500 占 퐂 / dm2 or more in the plating layer, The metal substrate may be selected from the group consisting of Ti, Si, Mg, P, Sn, Zn, Cr, Zr, V, W, Na, Ca, Ba, Cs, Mn, K, Ga, B, Nb, Ce, , Ho, Lu, Yb, Dy, Er, Pr, Y, Li, Gd, Pu, In, Fe, La, Th, Ta, U, Sm, Tb, Sr, Tm and Al Or more of the elements. |