| abstract |
The present invention relates to a resin composition comprising (A) a resin whose polarity is increased by the action of an acid and whose solubility in a developer containing an organic solvent is reduced, (B) a compound which generates an acid by irradiation with a specific active ray or radiation, and C) a step of forming a film using a sensitizing actinic ray or a radiation-sensitive resin composition containing a solvent, a step of exposing the film, and A method of forming a pattern including a step of developing an exposed film using a developing solution containing an organic solvent, Wherein the resin (A) has a structure in which the polar group is protected by a leaving group which is decomposed and eliminated by the action of an acid, and the leaving group is a group represented by the following general formula (I). [Chemical Formula 1] |