| abstract |
The present invention relates to a method for improving the mechanical properties, heat resistance, chemical resistance, and adhesiveness to a substrate in a post-process by introducing a high-hardness, high-sensitivity, high molecular weight ethylenically unsaturated monomer having excellent reactivity and polymerization stability and no impurities, To a thermosetting resin composition capable of improving the flatness characteristics of a substrate which is not deteriorated and which has a very large uneven step height. |