abstract |
The present invention relates to a photosensitive resin composition for an organic insulating film containing an alkali-soluble resin, an unsaturated ethylenic monomer, a photopolymerization initiator, a solvent, and a silane-based adhesion aid. More specifically, the present invention relates to a photosensitive resin composition for an organic insulating film, The present invention relates to a photosensitive resin composition in which pattern adhesion and developability are simultaneously improved. |