| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10636
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1469 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-183
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-185
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4697
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4857
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate |
2015-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65d65990c63a870c250d456ca97957d9 |
| publicationDate |
2016-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20160079658-A |
| titleOfInvention |
Method for manufacturing wiring board |
| abstract |
A method of manufacturing a wiring board according to the present invention includes the steps of preparing an insulating substrate having a cavity forming region and a wiring forming region; forming a first wiring conductor in the wiring forming region; A step of forming an opening in a part of the wiring formation region; a step of inserting an electronic part having an external electrode into the cavity; and a step of forming an insulating layer filling the gap in the cavity and the opening, A step of forming a through hole passing through the opening from the insulating layer on the upper surface side to the insulating layer on the lower surface side and a step of forming a second wiring conductor in the surface of the insulating layer and in the through hole do. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190012056-A |
| priorityDate |
2014-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |