| abstract |
The present invention relates to a nano-copper ink composition, a wiring board using the same, and a method of manufacturing the same. More specifically, the present invention relates to an ink composition capable of forming a wiring pattern having satisfactory lightness and electrical conductivity, . The present invention provides a nano-copper ink composition comprising pure copper particles, nano-oxide copper particles having a copper oxide film on the outside, a reducing agent for reducing nano-copper oxide particles to nano copper particles in light irradiation, a dispersant, a binder and a solvent. The present invention also relates to a method for manufacturing a nano-copper ink composition, which comprises screen printing a nano-copper ink composition on a flexible substrate body to form a preliminary wiring pattern, drying the screen-printed preliminary wiring pattern, And a light sintering step of reducing and sintering the oxidized copper of the nano-oxide copper particles contained in the preliminary wiring pattern to form a wiring pattern on the substrate body, and a wiring board manufactured by the manufacturing method do. |