| abstract |
A first interlayer insulating layer disposed on a front surface of a substrate, a TSV structure passing through the first interlayer insulating layer and the substrate, a lower end portion of the TSV structure protruding from a rear surface of the substrate, An insulating layer and a back passivation layer, a back insulating layer and a back bumping pad embedded in the back passivation layer and formed on the bottom portion of the TSV structure. |