abstract |
The present invention provides a curable composition having excellent flexibility and excellent adhesion to both a plastic substrate and a conductor layer, a coating film thereof, and a printed wiring board having the patterned cured coating film. (A) a block copolymer, (B) a (meth) acrylate compound having a hydroxyl group, and (C) a photopolymerization initiator, a coating film obtained by photocuring the composition, Pattern printed wiring board. |