| abstract |
The present invention relates to a photosensitive resin composition and an organic insulating film using the same, wherein the photosensitive resin composition contains an alkali-soluble resin containing a constituent unit derived from an unsaturated ester monomer containing an epoxy group and a constituent unit derived from an unsaturated organic acid monomer And is excellent in heat resistance, chemical resistance, resolution, and residual film ratio while having high flatness at the time of forming a coating film, and thus is suitable for use in materials such as an organic insulating film used in a liquid crystal display device, . |