http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160044862-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6f932d94618d9b875e401457b33e9761 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-206 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-202 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B33-00 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-06 |
| filingDate | 2014-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b7a6b5fd87a5b61e2b052ffaa7aac0fc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_514f265284a01feb4976c8a2512a6a7a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56d3f41d795c57d1061a4bb1c3c563f5 |
| publicationDate | 2016-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20160044862-A |
| titleOfInvention | Laminate structure for Flexible conductive plate and Method of manufacturing thereof |
| abstract | BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminate for a flexible conductive substrate, and more particularly to a laminate for a flexible conductive substrate, A release layer formed on the base substrate; A conductive pattern layer formed on the release layer; And an organic insulation layer formed on the release layer on which the conductive pattern layer is formed, wherein the contact angle of the release layer is in a range of 100 ° to 130 °, and the organic insulation layer has an organic insulation with a surface tension of 20 to 25 dyne / cm By forming the composition for layer formation, it is possible to reduce the peeling force between the release layer and the conductive pattern layer and between the release layer and the organic insulation layer to improve the releasability of the release layer from the laminate, The flat contact surface of the organic insulating layer can be realized irrespective of the contact angle. |
| priorityDate | 2014-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 191.