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filingDate 2015-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2016-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20160039554-A
titleOfInvention Curable composition for encapsulating optical semiconductor, and optical semiconductor device using the same
abstract [PROBLEMS] To provide a curable composition for optical semiconductor encapsulation which gives a cured product excellent in impact resistance and crack resistance, and also has low gas permeability, and a photosemiconductor device having a cured product of the composition. (A) a linear polyfluoro compound having two or more alkenyl groups in a molecule and having a perfluoropolyether structure in the main chain, (B) an organohydrogenpolysiloxane represented by the following general formula (1) [Chemical Formula 1] (C) a platinum group metal catalyst, (D) an organopolysiloxane having a hydrogen atom directly bonded to a silicon atom, a monovalent perfluoroalkyl group or a monovalent perfluorooxyalkyl group, an epoxy group or a trialkoxysilyl group, or both Wherein the hardness of the cured product of the composition is 30 to 70 in the type A durometer and the cured product having a thickness of 1 mm of the composition has a water vapor permeability of 10.0 g / m 2 ยท day or less Curable composition.
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