http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160039151-A

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filingDate 2014-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dda6fc17d6c632bc3a799ea7f1445eea
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publicationDate 2016-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20160039151-A
titleOfInvention Mold release film
abstract Disclosed is a release film suitable for the production of a flexible circuit board. It is an object of the present invention to provide a release film capable of suppressing occurrence of wrinkles while maintaining releasability. The present invention relates to a release film suitable for the production of a flexible circuit board, wherein the surface and the back surface are roughened, the 10-point average roughness Rz of the surface is 4 탆 or more and 20 탆 or less, (Except that the 10-point average roughness Rz of the surface is 4 占 퐉 or more and 5 占 퐉 or less and the thickness of the release layer constituting the back surface is 35 占 퐉 or more and 36 占 퐉 or less) to be.
priorityDate 2013-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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