Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-748 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1152 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-538 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-06 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
filingDate |
2014-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dda6fc17d6c632bc3a799ea7f1445eea http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef634ba465bce561f19c9d43dd224497 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bacdde69bb4e4c28f60472a4ca68462d |
publicationDate |
2016-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20160039151-A |
titleOfInvention |
Mold release film |
abstract |
Disclosed is a release film suitable for the production of a flexible circuit board. It is an object of the present invention to provide a release film capable of suppressing occurrence of wrinkles while maintaining releasability. The present invention relates to a release film suitable for the production of a flexible circuit board, wherein the surface and the back surface are roughened, the 10-point average roughness Rz of the surface is 4 탆 or more and 20 탆 or less, (Except that the 10-point average roughness Rz of the surface is 4 占 퐉 or more and 5 占 퐉 or less and the thickness of the release layer constituting the back surface is 35 占 퐉 or more and 36 占 퐉 or less) to be. |
priorityDate |
2013-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |