http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160037764-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_89afae566b725ae78e20cf972d9bcdc7 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-1233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D183-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D183-04 |
| filingDate | 2015-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48797a2958228a60bffad652d8521f99 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_def1e66f171cfd7af0ff3e3817c4e5da http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_21f2071f47c2eb28c5f18c23e38c528e |
| publicationDate | 2016-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20160037764-A |
| titleOfInvention | Film-forming composition and method of producing cured coating using the same |
| abstract | [assignment] The present invention also provides a film-forming composition which is cured even at a low temperature of 200 DEG C or less and gives a cured film with suppressed degassing, and a process for producing a cured film using the same. [Solution] The film-forming composition according to the present invention contains a polysiloxane represented by the following general formula (a1) and a thermal acid generator which is a quaternary ammonium salt. Wherein R 1 is a group containing an epoxy group or an oxetanyl group, R 2 is an alkyl group or an aryl group, and subscripts m and n denote molar percentages of the structural unit appended to the total structural units in the polysiloxane M is 50 to 90 mol%, and n is 10 to 50 mol%, with the proviso that the sum of m and n is 100 mol%. The method for producing a cured coating according to the present invention includes a composition layer forming step of forming a composition layer composed of the film-forming composition on a substrate, and a heating step of heating the composition layer. The heating temperature in the heating step is preferably 200 DEG C or less. |
| priorityDate | 2014-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 48.