abstract |
The present invention relates to a resin composition for an insulating film, and more particularly to a resin composition for a high performance insulating film for a printed circuit board having a low thermal expansion coefficient, low dielectric loss tangent, and strong adhesion to a metal. According to the present invention, reactive control can be facilitated and dielectric tangent can be greatly reduced. In addition, it is possible to obtain a resin for an insulating film which improves the adhesion between the metal and the insulating film and has a low thermal expansion coefficient and low dielectric loss tangent. |