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filingDate 2014-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a0b5b4983275168676640a062f6ad595
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publicationDate 2016-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20160036996-A
titleOfInvention Resin composition for insulating film
abstract The present invention relates to a resin composition for an insulating film, and more particularly to a resin composition for a high performance insulating film for a printed circuit board having a low thermal expansion coefficient, low dielectric loss tangent, and strong adhesion to a metal. According to the present invention, reactive control can be facilitated and dielectric tangent can be greatly reduced. In addition, it is possible to obtain a resin for an insulating film which improves the adhesion between the metal and the insulating film and has a low thermal expansion coefficient and low dielectric loss tangent.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3726944-A4
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