| abstract |
When a mechanical or chemical treatment is performed on the member to be treated, the member to be treated can be held by a high adhesive force and the member to be treated can be released easily without damaging the treated member A composition for forming a protective layer, a composition for forming an adhesive layer, and a kit. (B) an adhesive layer having a softening point of 250 DEG C or higher, (C) a protective layer, and (D) a device wafer in this order on the support (A) And the adhesive layer precursor has (b-1) a polymerizable compound. |