abstract |
The present invention relates to a composition for forming a conductive pattern and a resin structure having a conductive pattern, which can form a fine conductive pattern on various polymer resin products or resin layers by a simplified process and exhibit excellent heat radiation characteristics. The composition for forming a conductive pattern may include a polymer resin; A non-conductive metal compound having a specific chemical formula; And a heat dissipation material, and metal nuclei are formed from the non-conductive metal compound by electromagnetic wave irradiation. |