| abstract |
A polyimide layer having polyimide film arrangements having first and second surfaces facing each other, and a base layer releasably adhered to the first surface of the polyimide layer, the polyimide layer containing polyimide. The polyimide layer or base layer comprises a filler having a surface energy of less than about 35 dyne / cm. Moreover, the present invention also describes a method of making a polyimide film arrangement and its assembly on a substrate. |