http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160026758-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0264 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate | 2015-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2ba2d20706b9dcfa967c9141f229929 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_234d9ff72968957446fe9a8e3ebc01df |
| publicationDate | 2016-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20160026758-A |
| titleOfInvention | Method of manufacturing copper foil with carrier, method of manufacturing copper-clad laminate, method of manufacturing printed wiring board, and method of manufacturing electronic device, copper foil with carrier, laminate, printed wiring board, and electronic device |
| abstract | Provided is a method for producing a copper foil with a carrier having a good circuit formability against an ultra-thin copper layer. Further, there is provided a copper foil to which a carrier having good wettability of an etchant is adhered. A copper foil having a carrier provided with a carrier layer, an intermediate layer, an ultra-thin copper layer and a surface treatment layer including a silane coupling treatment layer in this order is subjected to heat treatment at a heating temperature of 100 to 220 DEG C for 1 to 8 hours or A method for producing a carrier-bonded copper foil comprising a heat treatment at a heating temperature of 100 ° C to 220 ° C for 1 hour to 6 hours or a heat treatment at a heating temperature of 160 ° C to 220 ° C for 2 hours to 4 hours . |
| priorityDate | 2014-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 141.