abstract |
A phenolic resin containing a phenolic hydroxyl group having excellent heat resistance and flame retardancy in a cured product, a phenolic resin containing the same, a cured product thereof, a semiconductor encapsulating material, and a printed wiring board. (I) [Wherein j and k are each 1 or 2, and at least one of j and k is 2] (X) represented by the following structural formula (II) Wherein l, m and n are each 1 or 2, and at least one of l, m and n is 2; (Y) represented by the following formula (1) as an essential component. |