| abstract |
An apparatus generally related to interposers 600, 700, 800 is disclosed. In such an arrangement, the interposers 600, 700, 800 may include a plurality of conductors 208, 451-459, 603-606 and a plurality of charge attracting structures 610, 620, 710, 720, 810, . The plurality of charge attracting structures 610, 620, 710, 720, 810, 820 include at least one integrated circuit die 202 to be coupled to the interposer 600, 700, 800 to provide a stacking die 200, . The plurality of conductors 208, 451-459, 603-606 includes a plurality of substrate-through vias 208. |