http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160001831-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3dba97693782916b637c6f28ea84b4a5 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| filingDate | 2014-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3fb82709a0110924fb1b5256a9aae0c8 |
| publicationDate | 2016-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20160001831-A |
| titleOfInvention | Method for manufacturing a circuit board |
| abstract | The present invention is characterized in that a dry film mask onto which a predetermined circuit pattern is transferred is coated on a base copper foil, and then a nickel plating layer is formed on the exposed copper foil, followed by copper plating to form a copper post. The copper plating layer is formed uniformly on the nickel plated layer, so that even if the height of the copper post is varied due to uneven plating, the nickel plated layer acts as an etch barrier for the copper chloride solution in the step of etching the base copper foil later So that there is no problem that the ball pad is etched and disappears. |
| priorityDate | 2014-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.