| abstract |
Provided is a thermosetting resin composition having high resistance to pressure resistance and excellent in heat resistance and storage stability. (A) a cyanate ester compound having at least two cyanato groups in one molecule (B) a phenol curing agent comprising a resorcinol-type phenol resin represented by the following formula (1) (Wherein n represents an integer of 0 or more and 10 or less, and R 1 and R 2 each independently represent a hydrogen atom, a monovalent group selected from an alkyl group having 1 to 10 carbon atoms, an allyl group and a vinyl group) (C) a tetraphenylborate salt of a tetra-substituted phosphonium compound, and a tetraphenylborate salt represented by the following formula (2) (Wherein R 3 is selected from a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, and a phenyl group, and n is an integer of 1 to 3) And a thermosetting resin composition. |