| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33c922e05f6133b7d72dbb849d77487d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L51-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F283-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L69-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L51-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F283-10 |
| filingDate |
2014-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_520eae651bbb0a3bd7b20baa494c2619
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c905e4a35e29fa24364c218e70f96d4f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8465c85ed6bb15aa69d18280fcad4b1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd0228f8407dee34b162d6780e759a08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_613548198e743d8a31e0f9c1a97a31b9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_24bb9eaddd8d7761b06b2bfaf397d3c6 |
| publicationDate |
2015-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20150139284-A |
| titleOfInvention |
Photo-curable and thermo-curable resin composition and dry film solder resist |
| abstract |
The present invention relates to an acid-modified oligomer; Photopolymerizable monomer; Thermosetting binder resin; Photoinitiators; Organic solvent; And an epoxy resin to which a carboxyl group-terminated butadiene / acrylonitrile copolymer is added; a dry film solder resist obtained from the resin composition; and a circuit including the dry film solder resist Substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022110140-A1 |
| priorityDate |
2014-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |