| abstract |
The present invention relates to a process for the preparation of N, N, N ', N'-tetrakis (2-hydroxypropyl) ethylenediamine or salts thereof, comprising the steps of: - a source of copper ions, - a source of a reducing agent or a reducing agent, , And ii) an electroless copper plating solution comprising a combination comprising N '- (2-hydroxyethyl) -ethylenediamine-N, N, N'-triacetic acid or a salt thereof, An electroless copper plating method, and the use of said solution for substrate plating. |