| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-182
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1841 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| filingDate |
2014-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d0ebc12e61d6392ebe8a374646e0f95
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd7e94f66d2edcdaa0e88972acfab215
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9194bdfff63eae6e51b341039bdc98d |
| publicationDate |
2015-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20150135446-A |
| titleOfInvention |
Method for activating a copper surface for electroless plating |
| abstract |
The present invention relates to a method of activating a copper or copper alloy surface for depositing a metal or metal alloy layer by electroless (autocatalytic) plating, which inhibits the formation of undesired voids. The copper or copper alloy surface is followed by electroless (autocatalytic) deposition of a metal such as palladium or a metal alloy such as Ni-P alloy after contacting the palladium ions, at least one phosphate compound and halide ions. |
| priorityDate |
2013-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |