| abstract |
It has an excellent adhesive strength to a substrate material and exhibits electric characteristics in a high frequency range of 1 GHz or more in frequency, specifically, low dielectric constant (epsilon) and low dielectric loss tangent (tan delta) in a frequency range of 1 GHz or more, A resin composition which is less in shrinkage stress at a time and can be thermally cured at 180 or lower, and an adhesive film and a coverlay film produced using the resin composition. (A) a vinyl compound represented by the following general formula (1), (B) a polystyrene-poly (ethylene / butylene) block copolymer having a styrene content of 15 to 35%, (C) (D) an epoxy resin, (E) bismaleimide, (F) an exothermic peak measured by differential scanning calorimetry (DSC) of 100 to 100 (B) / (C) = 1.00 or more and 4.00 or less, wherein the mass ratio of (A + E) / (B + C) is 0.81 or more and 1.00 or less, (F) as a mass percentage with respect to the content of the component (A), 0.1 to 10 mass% of the component (D) with respect to the total mass of the components (A) to To 10% by mass. |