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filingDate 2014-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2015-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20150129773-A
titleOfInvention TSV-less CTE Interposer Structure and Method
abstract A microelectronic assembly is provided that includes a dielectric region, a plurality of electrically conductive elements, a sealant, and a microelectronic element. The encapsulant has a coefficient of thermal expansion not exceeding two times the coefficient of thermal expansion (CTE) associated with at least one of the microelectronic element or the dielectric region.
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