| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-1067 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D133-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D133-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F299-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D4-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F299-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11 |
| filingDate |
2014-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_47a111168c8b618bd6b9b78cceed8289
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_861004cbbd8e893d486c707f55ffafc3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d1a9f53b3909fe4bff7091e85364e5e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0ba7b215ff6ec205b4a61d9c5a69209 |
| publicationDate |
2015-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20150126630-A |
| titleOfInvention |
Composition, cured product, stacked body, production method for underlayer film, pattern formation method, pattern, and production method for semiconductor resist |
| abstract |
Provided is a composition which is excellent in adhesion between a substrate and an imprint layer, has an excellent in-plane uniformity in film thickness, and can provide a lower film having a low defect density. Wherein the first solvent has a boiling point of 160 캜 or higher at 1 atm and a boiling point of 1 캜 of the second solvent is lower than 160 캜, Wherein the content of the polymerizable compound in the composition is less than 1% by mass. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200003912-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11710641-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200108453-A |
| priorityDate |
2013-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |