| abstract |
An underfill sheet capable of satisfactorily filling recesses and projections on a circuit surface of a semiconductor element and capable of satisfactorily connecting terminals of a semiconductor element and an adherend and capable of reducing outgassing. And has a viscosity at a temperature of from 150 to 150 ° C at a rotation rate of from 0.05 to 0.20 at a rate of from 1,000 to 10,000 Pa · s and a minimum viscosity at a temperature of from 100 to 200 ° C at a rate of from 0.3 to 0.7 revolutions per minute of not less than 100 Pa · s. |