| abstract |
The resin composition for high-dielectric constant material of the present invention contains 40 to 80 mass% of resin material (A) and 20 to 60 mass% of carbon black (B), and the carbon black (B) 50 (mL / 100 g) and an iodine adsorption amount of 5 to 40 (mg / g), and the resin composition for high dielectric constant material has a dielectric constant of 4 or more and a dielectric loss tangent of 0.05 or less. |