| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_64605f74fd2854c5874c9fb8d2cca1a7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-5073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 |
| filingDate |
2014-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d89310afc6886a571d342297794d20dc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82b0bbfa9171ee1590b45504425b40bb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_89d7ba62b0f41a195ff77ebfd9644a76 |
| publicationDate |
2015-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20150117166-A |
| titleOfInvention |
fluxing underfill composition and smt method using the same |
| abstract |
The disclosed invention relates to a fluxing underfill composition and a surface mounting method using the same. The surface mounting method according to the disclosed invention can be made such that the fluxing underfill composition according to the disclosed invention is provided to the process so that it does not include a separate fluxing process and an underfill process. A surface mounting method according to one aspect includes dipping a component into a fluxing underfill composition, mounting the dipped component to a substrate, and soldering the component to allow substrate bonding. |
| priorityDate |
2014-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |