abstract |
The present invention relates to a tin-silver electroplating solution, a process for producing the same, and a method for forming tin-silver solder bumps using the same, and more particularly, to a tin- silver solder bump containing no tin- and cyanidation compounds, - is an electroplating solution, a method of making the same, and a method of forming a tin-silver solder bump using the same. To this end, the tin-silver electroplating solution according to the present invention contains a total amount of 5 to 100 g / L of divalent tin ions, monovalent ions, sulfur compounds and thioamides, 2 to 5: 1. |