Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b2b31f8612f522a744762d83c23879ba |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2874 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0466 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2863 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
filingDate |
2014-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a16476464717551a8287a9b03a5f6f53 |
publicationDate |
2015-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20150112425-A |
titleOfInvention |
Test socket for semiconductor device |
abstract |
The present invention provides a semiconductor device comprising: a circuit board having an opening hole through which a semiconductor element is drawn, and contact pads contacting the lead wires of the semiconductor element; A base mounted on the back surface of the circuit board to support the circuit board; And a heater embedded in the base at the lower portion of the opening hole and applying heat to the semiconductor element drawn into the opening hole. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20220094605-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102537215-B1 |
priorityDate |
2014-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |