| abstract |
(A) an organopolysiloxane having a kinematic viscosity of 10 to 100,000 mm 2 / s at 25 ° C and having at least two alkenyl groups in one molecule, ( (C) a thermally conductive filler having a thermal conductivity of 10 W / m DEG C or higher, (D) an organosiloxane represented by the general formula (2) (E) an organohydrogenpolysiloxane containing, in addition to the component (D), at least two hydrogen atoms directly connected to silicon atoms in one molecule, (F) a group selected from the group consisting of platinum and platinum compounds Which has an appropriate range of storage modulus of elasticity, loss modulus of elasticity and loss coefficient, hardly causes pump-out or peeling at the time of a cold cycle, and is capable of obtaining a cured product in which an increase in thermal resistance is suppressed A thermally conductive silicone composition is provided. |