http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150107624-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2190-00 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 2015-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b28cd3055070180893e77f09fa400a8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88cf43b812972e1ee5bce076f865ce6b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e60b940ec6f10c400773ec8172f499d |
| publicationDate | 2015-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20150107624-A |
| titleOfInvention | Resin composition for sealing semiconductor and semiconductor device |
| abstract | The present invention has a purpose of providing a resin composition providing excellent cured product having high glass transition temperature, excellent mechanical strength and electric insulation under high temperature, lower absorbability and has less pyrolysis during long term management under the high temperature, has welding resistant reflow properties, and providing resin composition having excellent formability. The composition contains (A) an epoxy compound presented by following general formula (1); (B) 2 to 20 parts by weight of 100 parts by weight of sum of a copolymer (A) component, (B) component, and (C) component obtained by hydroxylation of an alkenyl group-containing epoxy compound and organo polysiloxane presented by following average formula (2); (C) a phenol compound presented by following chemical formula (3); and (D) an inorganic filler. |
| priorityDate | 2014-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 60.