| abstract |
A substrate for a power module according to the present invention comprises an insulating layer (11), a circuit layer (12) formed on a first surface of the insulating layer, and a metal layer (13) formed on a second surface of the insulating layer, A first base layer (20) is laminated on a surface of the metal layer opposite to the surface on which the insulating layer is formed, and the first base layer has a first glass layer formed at an interface with the metal layer, And a first Ag layer laminated on the glass layer. |