| abstract |
According to the present invention, there is provided a method for forming a penetrating electrode, comprising the steps of: (1) forming an electroless cobalt plating solution or an electroless nickel plating solution containing at least cobalt ions or nickel ions, a complexing agent, A step of forming a metal alloy film as a diffusion preventing layer against copper at the center of the hole from the inlet of the hole; (2) a step of forming a metal alloy film containing at least a cobalt ion or a nickel ion, a complexing agent, a reducing agent, (1) a step of forming a metal alloy film, which is a diffusion preventing layer, on the bottom of the hole from the center of the hole by using an electroless cobalt plating solution or an electroless nickel plating solution containing copper, , And a step of laminating a copper seed layer on the diffusion preventing layer formed in the step (2) . |