http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150098834-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-94 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0095 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0066 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0033 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0093 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-486 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48 |
| filingDate | 2014-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18e4ad5d4549af9f2c55526858a715dc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b0c7b529aee13489f10df10b47474005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0dfdd64b208219dcbf546937968bde4 |
| publicationDate | 2015-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20150098834-A |
| titleOfInvention | Method for manufacturing light emitting diode package |
| abstract | The present invention relates to a method for forming a light emitting structure comprising a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer on a growth substrate and forming first and second electrodes respectively connected to the first and second semiconductor layers step; Attaching a first surface of a transparent substrate having a first surface and a second surface opposite to the first surface on the light emitting structure; Determining positions of the first and second electrodes projected from the upper side of the second surface of the transparent substrate through the transparent substrate; Forming at least one through hole in a region corresponding to an upper portion of the first and second electrodes of the transparent substrate; And forming the first and second through electrodes by filling the through hole with a conductive material, thereby reducing the manufacturing cost of the light emitting diode package. |
| priorityDate | 2014-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 39.