http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150095611-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-205
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filingDate 2012-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e37b466064e5489a452521a2d4932d0d
publicationDate 2015-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20150095611-A
titleOfInvention Process and method for in-situ dry cleaning of thin film deposition reactors and thin film layers
abstract The present invention relates to the use of thionyl chloride and related materials to dry-etch the inner surface of a metal organic vapor phase epitaxy (MOVPE) reactor to remove deposits. The method is also useful for dry etching of a process substrate in such a reactor for cleaning and processing the substrate. The present invention is particularly applicable to chemical vapor deposition reactors used in the manufacture of high brightness LEDs based on III-V semiconductors such as GaN and related materials. Process features include CO 2 , COBr 2 , COI 2 , SOI 2 formed from heat, UV and plasma activated dry scrubbing, and combinations of pure materials or constituent gases such as CO, SO, SO 2 or NO and halogens , Etchant gases such as SOCl 2 , SOBr 2 , SO 2 Cl 2 , SO 2 Br 2 , NOCl, NOBr, NOI, S 2 Cl 2 , S 2 Br 2 , SCl 2 , SBr 2 , SOClBr, SOClF and SOFBr So that the desired effect can be achieved.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11717866-B2
priorityDate 2012-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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