http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150095478-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c3bf98aa6d4de2752f2f6fac638dc2cd |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J171-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J171-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-00 |
| filingDate | 2014-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fcfd0a3a7200c374b5692e24cfe63b3b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dce81adc3dc240238379a24e3c4fc413 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bffb88f88d48c77f03421eab160ffece http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf054034a037ab6e58ced57d88117892 |
| publicationDate | 2015-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20150095478-A |
| titleOfInvention | Adhesive composition for thermally conductive sheet and thermally conductive sheet therefrom |
| abstract | BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure-sensitive adhesive composition for a thermally conductive sheet and a thermally conductive sheet prepared therefrom, and more particularly, to a thermally conductive sheet using a conventional paste-type thermally conductive material or monomolecular epoxy Sensitive adhesive composition for a thermally conductive sheet capable of minimizing delamination of a surface of a substrate due to curing shrinkage which may occur in a thermal curing process of a thermally conductive sheet used and a thermally conductive sheet prepared therefrom. To this end, the pressure-sensitive adhesive composition for a thermally conductive sheet according to the present invention comprises a phenoxy resin, a thermosetting agent, and two kinds of thermally conductive filler mixtures having different average particle diameters, and the pressure-sensitive adhesive layer forms a crosslinked structure by thermosetting do. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018124319-A1 |
| priorityDate | 2014-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 49.