| abstract |
In order to provide a more uniform metal film on the substrate, the uneven initial metal film is deflected non-uniformly. Electrochemical depletion can be performed by placing the substrate in a specially formulated deflating bath for plating rather than plating. The deflecting bath may have a throwing power of 0.3 or less, or a bath conductivity of 1 ms / cm to 250 ms / cm. The reverse current, which is conducted through the deflecting bath, non-uniformly electrolytically etches or deflates the metal film. |