abstract |
The present invention provides a photosensitive resin composition comprising 100 parts by weight of a maleimide-based phenol resin represented by the following formula (1), and 100 to 500 parts by weight of a polyamide-based resin. Wherein R 7 is a hydrogen atom, CH 3 , CH 2 OH or CH 2 OCH 3 , and n is an integer of 1 to 1000. (One) |