| abstract |
An object of the present invention is to provide a photosensitive epoxy resin composition having a vertical sidewall shape by photolithography and capable of forming an image having high resolution, low stress and humidity resistance, and / or a resist laminate thereof, and a cured product thereof. The present invention relates to an epoxy resin composition containing an epoxy resin (A), a polyhydric phenol compound (B) having a specific structure, a cationic photopolymerization initiator (C), an epoxy group-containing silane compound (D), and a reactive epoxy monomer The photosensitive resin composition according to any one of (1) to (4), wherein the epoxy resin (A) comprises an epoxy resin (a) obtained by reacting a phenol derivative represented by the following formula (1) with epihalohydrin, and an epoxy resin b). |