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filingDate 2014-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6230cb40c6ec26e5e08d3818fde4f55
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publicationDate 2015-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20150084329-A
titleOfInvention Solder paste and bonding structure using the same
abstract The solder paste according to the embodiment of the present invention includes a plurality of metal particles and a flux component, and each of the metal particles may include tin (Sn) or tin (Sn-based) ) Alloy, and the core metal is formed of a metal having a lower resistivity than the tin or tin-based alloy.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020530396-A
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priorityDate 2014-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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