http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150083988-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6038f17109882ad88e9ba8ea907ebb45 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0789 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1476 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1509 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1545 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0035 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0085 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 2013-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12eb902a3ec393eccd7074f97db903de http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90160df5a65ff18ba94af20e725170b1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_657db1f41a8d6d9012f5d0466121c703 |
| publicationDate | 2015-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20150083988-A |
| titleOfInvention | Method for manufacturing printed circuit board and surface treatment device for same |
| abstract | A manufacturing method of a printed wiring board capable of suppressing fluctuation of a hole diameter caused by conveyance flaws in horizontal conveyance and capable of reducing laser processing energy and a surface treatment apparatus used therefor. A method for producing a printed wiring board according to the present invention comprises a pretreatment step of surface-treating a copper layer (3) on the surface layer of a laminate for manufacturing a printed wiring board (10), a step of irradiating a surface of the copper layer And a laser processing step of forming a hole. The pretreatment step includes a first surface treatment step of bringing the surface of the copper layer 3 into contact with the aqueous solution A under an oxygen-containing atmosphere, a step of bringing the surface of the copper layer 3 after the first surface treatment step into contact with the aqueous solution B 2 surface treatment process. In the present invention, in the second surface treatment step, the surface of the copper layer 3 is brought into contact with the aqueous solution B without supplying oxygen. |
| priorityDate | 2012-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 48.