| abstract |
Provided is a polishing composition which is suitable for polishing an object to be polished having a metal wiring layer (14) and can reduce a step defect while maintaining a high polishing rate. A polishing composition for use in polishing an object to be polished having a metal wiring layer (14), the polishing composition comprising a metal anticorrosive, a complexing agent, a surfactant, and water, And the solid surface energy of the surface of the subsequent polishing object is 30 mN / m or less. The surfactant is preferably an anionic surfactant. |