http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150080225-A

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filingDate 2013-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ddb6043733fbe6b7d258f662eb7b3f4d
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publicationDate 2015-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20150080225-A
titleOfInvention Biosensor package and packaging method thereof
abstract A biosensor package including a communication element and a manufacturing method thereof are disclosed. A method of fabricating a semiconductor package for a biosensor includes: laminating a first metal layer on a base; Forming an antenna pattern corresponding to a communication element and an SMT circuit pattern for mounting a plurality of electronic circuit elements on the first metal layer; Stacking a second metal layer on a region where the antenna pattern and the SMT circuit pattern are formed; And forming a reference / sensing electrode pattern for measuring a specific component included in the sample introduced into the second metal layer.
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