Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_43c4830697b5f5213fd2ae99967f013b |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-416 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-403 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N33-48 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N27-403 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N33-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N27-416 |
filingDate |
2013-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ddb6043733fbe6b7d258f662eb7b3f4d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f50b498d822488d6e9558e640b11ff66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1633432a32179b246ff7ec439034552d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79853c5f0cdfde6da2fff246ab15565f |
publicationDate |
2015-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20150080225-A |
titleOfInvention |
Biosensor package and packaging method thereof |
abstract |
A biosensor package including a communication element and a manufacturing method thereof are disclosed. A method of fabricating a semiconductor package for a biosensor includes: laminating a first metal layer on a base; Forming an antenna pattern corresponding to a communication element and an SMT circuit pattern for mounting a plurality of electronic circuit elements on the first metal layer; Stacking a second metal layer on a region where the antenna pattern and the SMT circuit pattern are formed; And forming a reference / sensing electrode pattern for measuring a specific component included in the sample introduced into the second metal layer. |
priorityDate |
2013-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |