http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150062988-A

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filingDate 2014-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_234d9ff72968957446fe9a8e3ebc01df
publicationDate 2015-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20150062988-A
titleOfInvention Surface-treated copper foil, laminate, printed wiring board, electronic device, copper foil with carrier and method of maunfacturing printed wiring board
abstract Provided is a surface treated copper foil whose transmission loss is suppressed even when used on a high frequency circuit board. A surface-treated copper foil having a surface treatment layer formed on at least one surface thereof, wherein the total adhesion amount of Co, Ni and Fe in the surface treatment layer is 1000 占 퐂 / dm2 or less and the surface treatment layer is a Zn metal layer or an alloy Wherein the ratio of the three-dimensional surface area to the two-dimensional surface area measured by a laser microscope on the surface treatment layer surface is 1.0 to 1.9 and the surface roughness Rz JIS of at least one surface is 2.2 m or less.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160149149-A
priorityDate 2013-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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