| abstract |
The present invention provides an anisotropic conductive adhesive which achieves high heat dissipation. The conductive particles 31 and the solder particles 32 are dispersed in the binder. The LED mounting body thermally bonded using the anisotropic conductive adhesive is electrically connected to the terminals (electrodes 12a and 14a) of the LED element and the terminals (electrodes 22a and 23a) of the substrate through the conductive particles 31 Together, the terminal of the LED element and the terminal of the substrate are soldered. |