| abstract |
The disclosure discloses a semiconductor package that includes a contact pad, a device external to the contact pad, and a solder bump on the contact pad. The device has a conductive contact pad corresponding to the contact pad. The solder bumps connect the conductive contact pads and the contact pads. The solder bump has a height from the top of the solder bump to the contact pad; And the widest dimension of the solder bump in the direction perpendicular to the height. The junction of the solder bump proximate the contact pad includes an hourglass shape. |